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Characteristics:
- Newly developed Electron Image Acquiring
System (EIAS)
- Wide field of view (FOV)
- Cr, MoSi and Quartz mask compatible
- Proprietary image processing algorithm for
real time inspection
- Can handle design data of several hundred
gigabytes
- Power spectrum analysis (under development)
using FOV
- Indispensible for improving the precision of
lithography simulations
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Basic
Applications: ¡íSEM-Image and design data
comparison (GDS format output) ¡íCD
measurement
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